首页> 外文会议>Society of Vacuum Coaters Annual Technical Conference; 20050423-28; Denver,CO(US) >Model Prediction and Empirical Confirmation of Rate Scaling with Peak Power for High Power Pulse Magnetron Sputtering (HPPMS) Deposition of Thin Ag Films
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Model Prediction and Empirical Confirmation of Rate Scaling with Peak Power for High Power Pulse Magnetron Sputtering (HPPMS) Deposition of Thin Ag Films

机译:Ag薄膜高功率脉冲磁控溅射(HPPMS)沉积的峰值功率速率缩放的模型预测和经验确认

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摘要

The high power pulsed magnetron sputtering (HPPMS) technique is a novel process technology for large area magnetron sputtering. HPPMS allows for a high fraction of ionized target material at the workpiece and thus for growth conditions similar to pulsed laser deposition and filtered arc deposition. However, a reduction in deposition rate compared to DC sputtering has been observed for operation at the high peak target power densities associated with HPPMS. This reduction in deposition rate with increasing peak power has been observed for HPPMS deposition of thin silver films. The existence and nature of the deposition rate loss is predicted by amodel previously proposed by Christie (ICMCTF, 2004). In this paper, model predictions are correlated to experimental results for HPPMS silver deposition. We report on the rate reduction observed empirically and its correlation to expectations based on the proposed rate loss model.
机译:高功率脉冲磁控溅射(HPPMS)技术是一种用于大面积磁控溅射的新型工艺技术。 HPPMS可在工件上实现较高比例的离子化目标材料,因此可实现类似于脉冲激光沉积和过滤电弧沉积的生长条件。但是,在与HPPMS相关的高峰值目标功率密度下运行时,已观察到与DC溅射相比沉积速率降低。对于银薄膜的HPPMS沉积,已经观察到随着峰值功率的增加沉积速率的降低。沉积速率损失的存在和性质由克里斯蒂先前提出的模型预测(ICMCTF,2004)。在本文中,模型预测与HPPMS银沉积的实验结果相关。我们基于经验提出的费率损失模型,报告根据经验观察到的费率降低及其与预期的相关性。

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