Stress intensity factors of delamination interface in IC packages subject to non-steady thermal stress

摘要

Interface delamination in IC Packages is a critical issue in both structural design and material selection of plastic IC packages. The 2-D finite element analysis was carried out to estimate the stress-intensity factor of delamination interface in IC packages subject to non-steady thermal stress. The stress-intensity factor K associated with a thermal interface crack was discussed from three different approaches: virtual crack extension method, modified crack closure integral and displacement extrapolation. An accuracy of stress intensity factors obtained by finite element analysis was discussed by comparison of results by different approaches.