Arrangement for stress reduction for substrate-based chip packages has uniform trench-shaped structures on chip side of substrate to interrupt or displace thermally induced mechanical stress

摘要

The stress reduction arrangement has uniform trench-shaped structures (11) formed on the chip side of the substrate (1) to which the chip is fixed so as to enclose the chip (6) so as to interrupt or displace the thermally induced mechanical stress in the substrate. The trench-shaped structures are etched into the substrate.