Development Of New Electrodeposited Copper Foil A new copper foil has been developed for the recent trend of higher density and thinner printed circuit boards (PCBs). First, VLP foil with smaller crystal grain size than the conventional copper foil was developed focusing on the fact that the etching speed becomes faster as the crystal grain size becomes smaller. Then, observing the phenomenon which takes place in the etching process from a microscopic point of view, the shiny side (S side) of the VLP foil was uniformly nodulized (treated) to have the best etching characteristics. Thus the new copper foil was developed. This new copper foil was compared with a conventional copper foil for evaluation. It was found that with the new copper foil the etched circuit pattern was excellent with minimal embedded copper in the circuit board and dielectric quality between the lines and layers was high. Therefore, this new copper foil can be expected to meet the demand for higher density and thinner products.
展开▼
