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Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath

机译：焦磷酸盐铜镀浴中无机添加剂电沉积薄铜膜特性研究

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Seokbon Koo; Jinyoung Hur; Hongkee Lee;
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2. 添加剂对从无氰电解质中电沉积铜的协同效应及其结构和形貌特征 [J] . R. SEKAR 中国有色金属学报：英文版 . 2017,第007期
3. Polarographic study on the Smoothing of Sn-Ag Alloy Film Electrodeposited from Pyrophosphate-Iodide Bath [J] . Susumu Arai, Norio Kaneko, Naoyuki Shinohara Electrochemistry communications . 2001,第4期

机译：焦磷酸盐-碘化物浴中电沉积Sn-Ag合金膜的平滑的极谱研究
4. Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films [J] . Mladenovi? Ivana, Lamovec Jelena, Jovi? Vesna, Serbian Journal of Electrical Engineering . 2017,第1期

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5. Comparative study on physical and electrochemical characteristics of thin films deposited from electroless platinum plating baths [J] . Mizuhashi Shoei, Cordonier Christopher E. J., Matsui Hironori, Thin Solid Films . 2016,第nova30期

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6. Dependency of the band gap of electrodeposited Copper oxide thin films on the concentration of copper sulfate (CuSO4.5H2O) and pH in bath solution for photovoltaic applications [C] . Md. Anisul Islam, Sheikh Jaber Nurani, Md. Adnan Karim, International Conference on Electrical Electronic Engineering . 2015

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7. The Effects of Additives on the Nucleation and Growth Kinetics of Electrodeposited Copper Nanostructures and Thin Films [D] . Han, Yun Yu Joseph 2012

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8. Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films [O] . Tatsuya Tsurusaki, Takeshi Ohgai 2020

机译：电沉积Sn-Zn合金膜的钎焊铜棒的力学性能
9. Influence of Chemical Composition of Pyrophosphate Copper Baths on Properties of Electrodeposited Cu Films [O] . Dong-Yul Shin, Bon-Keup Koo, Deok-Yong Park 2015

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10. Copper Pyrophosphate/PY61H Plating Bath: Control of Ammonia [R] . Borhani, K. J. 1982

机译：焦磷酸铜/ pY61H电镀浴：控制氨

Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath

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