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Trap competition inducing R.T.S noise in saturation range in N-MOSFETs

机译:陷阱竞争在N-MOSFET的饱和范围内引起R.T.S噪声

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A characterization of low frequency noise in submicron N-MOSFETs is presented. For large devices, it is found that l/f noise results from carrier number fluctuations. The slow oxide interface trap density deduced from noise data is found around 10~(16) eV~(-1) cm~(-3) in agreement with state-of-the-art gate oxides. Submicron devices present R.T.S noise and exhibit three independent active traps in saturation range, from weak to strong inversion. All of these traps have been found as acceptor type centers. Their activity ranges, their maximum of activities and their positions in the oxide from the Si-SiO_2 interface have been obtained by the study of emission and capture times against gate voltage. It is shown existing overlap in trap activities for particular gate bias ranges. This overlap is confirmed by the observation of multi level R.T.S in time and frequency domains. For each trap, the number of R.T.S events is explained using the trap occupation probability. Finally, the global R.T.S behavior of devices, including the whole trap activities from weak to strong inversion, could be described using the simple R.T.S model classically used for a single oxide trap. This global study shows a simple method to determine R.T.S impact, and describes perfectly multi-trap activity.
机译:提出了亚微米N-MOSFET中低频噪声的表征。对于大型设备,发现l / f噪声是由载波数波动引起的。由噪声数据推导出的慢速氧化物界面陷阱密度与最新的栅极氧化物一致,约为10〜(16)eV〜(-1)cm〜(-3)。亚微米器件呈现R.T.S噪声,并在饱和范围(从弱到强反转)中表现出三个独立的有源陷阱。所有这些陷阱已被发现为受体类型中心。通过研究相对于栅极电压的发射和捕获时间,可以得到它们的活性范围,最大活性以及它们在Si-SiO_2界面的氧化物中的位置。结果表明,对于特定的栅极偏置范围,陷阱活动中存在重叠。通过在时域和频域中观察多级R.T.S可以确认这种重叠。对于每个陷阱,使用陷阱占用概率来说明R.T.S事件的数量。最后,可以使用传统上用于单个氧化物陷阱的简单R.T.S模型来描述设备的整体R.T.S行为,包括从弱反转到强反转的整个陷阱行为。这项全球性研究显示了一种确定R.T.S影响的简单方法,并完美描述了多陷阱活动。

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