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Microstructure of TiN layers used as ohmic contacts on GaN

机译:TiN层的微结构用作GaN上的欧姆接触

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TEM investigations have been carried out on annealed Al/Ti/GaN and directly deposited TiN films on GaN.In the Al/Ti/GaN system,the annealing step gave rise to a approx 20 nm rough TiN film.The ohmic contact is made by TiN crystallites which are epitaxially related to GaN,the orientation relation ship being (0001) GaN//(111) TiN.In between,amorphous patches of 1 to 2 nm extension can be found.When stoichiometric TiN was deposited directly on GaN,we obtained columnar TiN grains of 10-20 nm section,which cross the whole film thickness and are rotated mostly around the [111] axis.The epitaxial relationship is similar and no amorphous patches are observed at the interface.
机译:在退火过的Al / Ti / GaN上进行了TEM研究,并在GaN上直接沉积了TiN膜。在Al / Ti / GaN系统中,退火步骤产生了约20 nm的粗糙TiN膜。与GaN外延相关的TiN晶体,其取向关系为(0001)GaN //(111)TiN。在它们之间,可以发现延伸1至2 nm的非晶斑。当化学计量的TiN直接沉积在GaN上时,我们得到的柱状TiN晶粒的截面为10-20 nm,横穿整个膜的厚度并且大部分围绕[111]轴旋转。外延关系相似,并且在界面上未观察到非晶斑。

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