首页> 外文会议>Conference on microscopy of semiconducting materials >Microstructure of TiN layers used as ohmic contacts on GaN
【24h】

Microstructure of TiN layers used as ohmic contacts on GaN

机译:用作GaN上的欧姆接触的锡层的微观结构

获取原文

摘要

TEM investigations have been carried out on annealed Al/Ti/GaN and directly deposited TiN films on GaN. In the Al/Ti/GaN system, the annealing step gave rise to a ~20 nm rough TiN film. The ohmic contact is made by TiN crystallites which are epitaxially related to GaN, the orientation relationship being (0001)GaN//(111)TiN. In between, amorphous patches of 1 to 2 nm extension can be found. When stoichiometric TiN was deposited directly on GaN, we obtained columnar tiN grains of 10-20 nm section, which cross the whole film thickness and are rotated mostly around the [111] axis. The epitaxial relationship is similar and no amorphous patches are observed at the interface.
机译:已经在退火的Al / Ti / GaN上进行了TEM调查,并直接在GaN上沉积锡膜。在Al / Ti / GaN系统中,退火步骤产生了〜20nm粗锡膜。欧姆接触由与GaN外延相关的锡结晶制造,取向关系是(0001)GaN //(111)锡。在两者之间,可以找到1至2nm延伸的无定形斑块。当直接沉积在GaN上的化学计量锡时,我们获得了10-20nm部分的柱状锡颗粒,其通过整个膜厚度交叉并且大部分围绕[111]轴线旋转。外延关系是相似的,并且在界面处没有观察到无定形斑块。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号