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Use of laser transfer processing for producing Al-Bi doped silicon electronic devices

机译:激光转移处理在生产Al-Bi掺杂的硅电子器件中的应用

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This work explores the combination of laser transfer and laser doping in a single process, as a way to produce highly defined, heavily doped volumes on semiconductors, to produce electronic devices. The process has been realized on mono and multicrystalline silicon by means of nanosecond laser pulses. The paper studies the mechanism of the process and the requirements in terms of beam shaping, energy levels and specific constrains of the setup to get proper dopant transfer and diffusion, as well as high compositional gradient. Bismuth is selected as n-dopant, and aluminum is used as an already well known solution for laser driven heavy p-doping on silicon. The suitability of laser transfer doping for direct writing of electronic devices is assessed in terms of transfer, melting and doping capability, and compared with other State-of-the-Art laser doping processes.
机译:这项工作探索了在单个过程中结合激光传输和激光掺杂的方法,以此作为在半导体上产生高定义,重掺杂体积的方法,从而生产出电子设备。该方法已经通过纳秒激光脉冲在单晶硅和多晶硅上实现。本文研究了该过程的机理以及在束整形,能级和特定约束条件方面的要求,以获得适当的掺杂剂转移和扩散以及高成分梯度。铋被选作n掺杂剂,而铝被用作激光驱动的硅重质p掺杂的众所周知的解决方案。根据转移,熔化和掺杂能力,评估了激光转移掺杂对直接写入电子设备的适用性,并与其他最新的激光掺杂工艺进行了比较。

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