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The Influence of Thermal Effects and Dielectric Films on the Electronic Quality of p +-Doped Silicon Processed by Nanosecond Laser

机译:热效应和介电膜对纳秒激光加工p + 掺杂的硅的电子质量的影响

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摘要

Laser doping of silicon is a complex process involving thermal effects and interactions between different materials far from equilibrium and over a short period. In this paper, diffused samples capped with different dielectric films (including bare surfaces) are processed using laser pulses of 20–400 ns duration and characterized by photoluminescence (PL) imaging to study the degradation of the electronic properties of the processed regions. This way, without the interference of a dopant precursor, the thermal and dielectric effects are separately investigated. It is found that the thermal effects (melting and recrystallization of the silicon) do not lead to significant damage and additional recombination, provided no severe silicon evaporation occurs. However, when a dielectric film is present, a considerable increase in recombination is observed, irrespective of laser parameters, indicating the formation of additional defects. The magnitude of the increase in recombination varies substantially, depending on the dielectric used. Repeated pulses appear to repair silicon damage introduced by the first pulse or pulses for long pulse durations but result in a slight degradation for short pulse durations. Combining the PL results and four-point probe measurement of laser-doped samples, it is demonstrated that both high dopant incorporation (sufficient silicon melting) and low recombination can, in principle, be achieved, particularly when samples are processed using long pulse durations and small pulse distances.
机译:硅的激光掺杂是一个复杂的过程,涉及热效应以及不同材料之间的相互作用,其作用远非平衡状态,而且持续时间很短。在本文中,使用20-400 ns持续时间的激光脉冲处理覆盖有不同介电膜(包括裸露表面)的扩散样品,并通过光致发光(PL)成像来研究加工区域电子性能的下降。这样,在没有掺杂剂前驱物干扰的情况下,可以分别研究热效应和介电效应。已经发现,只要不发生严重的硅蒸发,热效应(硅的熔化和重结晶)不会导致明显的损坏和额外的复合。然而,当存在介电膜时,无论激光参数如何,观察到复合的显着增加,表明形成了额外的缺陷。取决于所使用的电介质,复合增加的幅度变化很大。重复的脉冲似乎可以在较长的脉冲持续时间内修复由第一个或多个脉冲引入的硅损坏,但在较短的脉冲持续时间内会导致轻微的劣化。结合PL结果和激光掺杂样品的四点探针测量,证明了原则上既可以实现高掺杂掺入(硅熔融充分)又可以实现低重组率,特别是在使用长脉冲持续时间和脉冲距离小。

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