ANALYSIS OF MANUFACTURING PROCESS IMPACTSON HIGH SPEED ORGANIC PACKAGING APPLICATIONS

摘要

As high frequency is becoming a pervasive element in new application spaces and commodityrnproducts a new price/performance equation applies pressure to system designers in selecting costrneffective solutions.rnFor this reasons organic laminate used in electronic packaging are being considered for a new spanrnof products development, also for products historically less sensitive to costs.rnOrganic laminates are being perceived as “Good candidates” for low cost analog/digital applications,rnbut they still need to be fully understood in terms of behaviour in the GHz range.rnThe selection of a specific technology among others should take into considerations at least threernmajor items: first is the materials characteristics, second, the availability of optimized design rules forrnhigh sp This becomes true whenever the device physical dimensions become comparable with thernelectrical signal wavelength.rnFor high speed applications a correct dimensioning of all circuit structures become important; at thisrnpoint, features like line traces, pin through holes versus laser or buried vias are dimensioned to avoidrnperturbation in the transmission of high-speed signals.rnThe study analyzes and shows which levels of performance skew the product designer can expect inrnthe final product performance due to manufacturing tolerances.eed applications and last but notrnleast, the correct understanding of product performance stability across all possible effects, in thernselected laminate product, driven by the manufacturing operations.rnThe authors have in this study focused on the third aspect with the objective of identifying the mostrncritical aspects to be monitored while manufacturing high-speed laminate products.rnClassic electrical theory and modeling applied for the low speed signals becomes inadequate whenrnsubstrates are used to carry high frequency signals. Microwave theory and the RF design approachrnneed to be implemented.