Surface mountable wireless package with open cavity for high-performance HF applications, process for manufacturing a HF semiconductor package and a HF semiconductor package

摘要

HF semiconductor package, comprehensive:a substrate (110) with generally flat upper and lower surfaces, the substrate (110) comprising a base metal area (116) extending from the top to the bottom surface, one or more metallic signal termination areas (118);extending from the top to the bottom surface without extending from the substrate (110) sideways to the outside, and an insulating material (119),which separates the metallic areas;an HF semiconductor (120) with a bottom surface mounted on the surface of the substrate (110) at the base area (116) of the substrate, with the HF semiconductor (120) having a connecting pad (120) mounted on a surface of the HF semiconductor (120), where the connecting pad (124) is electrically connected to one of the signal termination areas (118) of the substrate (110) on the surface of the substrate,where the lower surface of the HF semiconductor (120) is a source connection of the HF semiconductor (120), where one of the substrate's first signal termination areas (118) is electrically connected to an input path of the HF semiconductor (120) and another of the substrate's signal termination areas (118) is electrically connected to an output path of the HF semiconductor (120);a cover (130) which is mounted on the surface of the substrate (110), so that the HF semiconductor (120) of the cover (130)is enclosed to form an open cavity around the HF semiconductor (120); andwhere the base area (116) and each signal terminal area (118) of the substrate (110) are configured for surface mounting at the bottom surface of the substrate (110).