surface mount wireless package with an open cavity for high performance - hf - applications

摘要

A hf - half conductor package contains a substrate (110) having a generally planar upper and lower surfaces. The substrate (110) contains a metallic base region (116) and one or more metallic signal connection areas (118), which extends from the upper surface to the lower surface, and an insulating material (119), which separates the metallic areas. The lower surface of a hf - semiconductor die (120) is connected to the base region (116) are on the upper substrate surface. The hf - semiconductor die (120) has a on an upper surface of the hf - semiconductor die (120) arranged on a terminal pad (124). The lead (124) is electrically connected to one of the signal connection areas (118) connected on the upper substrate surface. A cover (130) is mounted on the upper substrate surface, so that the hf - semiconductor die (120) of the cover (130) is enclosed, around the hf - semiconductor die (120) is an open cavity. The base - and signal connection areas (116, 118) for surface mounting are configured on the lower substrate surface.