Flip-Chip - The Ultimate Solution Comparing Flip-Chip and Chip Scale Packaging

摘要

Flip-chip is becoming increasingly more important and interesting since it has some of the most desired advantages, namely short interconnects for improved electrical performance, and reduction of size and weight leading to cost savings since less silicon and board material is used. Still there are some severe drawbacks, mainly the process time, especially related to underfill and the poor availability of low-cost substrates with the fine lines and spacings required for area array flip-chips.