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Substrates for packaging flip-chip light emitting device and flip-chip light emitting device package structures
Substrates for packaging flip-chip light emitting device and flip-chip light emitting device package structures
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机译:用于封装倒装芯片发光器件的基板和倒装芯片发光器件封装结构
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摘要
A substrate for packaging flip-chip light emitting device (LED) includes a substrate including a chip mount region, a first metal pattern overlapping a part of the chip mount region and disposed on the substrate, a second metal pattern disposed in a region including the chip mount region that is not overlapped with the first metal pattern, at an outer side of the first metal pattern, a third metal pattern disposed at an outer side of the second metal pattern, a first isolation line defined in a boundary between the first metal pattern and the second metal pattern, a second isolation line defined in a boundary between the second metal pattern and the third metal pattern, a lower pad disposed on a bottom of the substrate, and a via disposed to connect the first and second metal patterns to the lower pad in the substrate.
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