Failure Load Prediction of Adhesion in Solderable Thick Film Conductors

摘要

This paper describes a method for predicting the force required to cause adhesion failure at the thick film conductor and alumina substrate interface. The prediction utilises a finite element model in order to determine the energy required to cause adhesion failure. This enables prediction of the number of fatigue cycles required to lift the thick film conductor from the alumina substrate. The model requires an iteration between the Finite Element model and experiemental results based on real conductor ink systems, in order to prove the validity of the analysis. Adhesion strength is determined by the mechanical properties of the thick-film ink bonding mechanisms, geoemtry and processing conditions. This paper is intended to increase the understanding of the adhesion properties between the thick-film ink and the substrate.