CASE STUDIES OF TIN/LEAD AND LEAD-FREE SOLDER PROCESS CROSS CONTAMINATION

摘要

Since the implementation of the Restriction of Hazardous Substances (RoHS) legislation, segments of the electronics industry have been producing lead-free soldered products for over 13 years. Many of these lead-free soldering processes are structured around well characterized solder process materials, vetted process controls and demonstrated reliability track records in their respective product use environments. What happens when the process goes wrong? What happens when there is cross contamination between a tin/lead and lead-free soldering process due to human error? This paper documents two cross contamination case studies of tin/lead soldering and lead-free soldering processes. Detailed assessment techniques and lessons learned are presented.