Process for producing a high-temperature-resistant lead-free solder connection and high-temperature-resistant lead-free solder connection

摘要

The invention relates to a method for producing a high-temperature-resistant lead-free solder connection (7; 71) between a printed circuit board (1) and a component (2; 2b), in which a lead-free solder molded part (3; 3b) is used, which has a composite material with a Has first composite component (VK1) arranged essentially in layers; and in which the component (2; 2b) is soldered to the solder molded part (3; 3b) in a strap selective soldering process. The invention further relates to a high-temperature-resistant lead-free solder connection (7; 71) and a field device (8) of automation technology for determining and / or monitoring the process variable of a medium with a high-temperature-resistant solder connection (7; 71).