Lead-free tin alloy for soldering connections, lead-free soldering, sphere network structure for placing electronic components on circuit boards, and connection between an electronic component and a circuit board.

摘要

"LEAD-FREE WELDING CONTAINING INDIAN AND A GRANULATION REFINER, SPHERE NETWORK STRUCTURE TO DISPOSE ELECTRONIC COMPONENTS ON CIRCUIT BOARDS, AND, CONNECTION BETWEEN AN ELECTRONIC COMPONENT AND A CIRCUIT BOARD". A lead-free alloy for solder bonding comprising up to 0.25% by weight of indium and a granulation refiner which is an alloy consisting of, by weight, 2.5% to 10% aluminum, 1 to 5% magnesium and the rest in zinc. The alloys have improved mechanical properties, such as drag resistance, and improved resistance to thermal fatigue.