Baseplate materials used for the high-temperature operation of silicon carbide (SiC) power modules must have mechanical properties suitable for maintaining the reliability of solder joints. In addition, to efficiently dissipate heat generated from a SiC device, superior thermal specifications are required for the baseplate material. In this study, we investigated the mechanical properties of the baseplate materials using finite element method (FEM) simulation and thermal-deformation observation. Thus, we showed that the shear stress at a solder joint can be reduced by using aluminum-carbon (AlC) or copper-molybdenum-copper (CMC) baseplates, both of which have a low value of Young's modulus. We also measured the steady-state and transient thermal resistances of these materials and showed that CMC baseplate has superior thermal properties. In this study, we showed that among the baseplate materials that were studied, the CMC baseplate is optimal for the high-temperature operation of SiC power modules.
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