Transfer-Molded SiC Power Module Enables High-Temperature Operation

摘要

With the adoption of a highly heat-resistant resin, the transfer-molded type silicon carbide (SiC) module from ROHM Co., Ltd. can be operated in a temperature as high as 225℃. The employment of an optimal module structure design resulted to a compact device measuring 32 × 48 × 3mm, one-fifteenth of the conventional Si insulated gate bi-polar transistor module with the same functions.