SiC OBC SiC Automotive OBC Power Module with Environment-Friendly High-Temperature Bonding Materials

摘要

The present invention relates to an SiC-based OBC power conversion module, and more specifically, to a high-efficiency, lightweight, SiC-based power conversion module for securing the vehicle's reliability when the heat resistance temperature of 300 ℃ or more when driven at high temperature (Power chip), DBC (Direct SiC-based OBC power conversion module for electric field using low-power bonding technology that considers heat dissipation of components such as bond copper), aluminum wire, and base plate, that is, eco-friendly high-temperature bonding material that does not dissolve under high temperature / high current conditions As for Specific solution of the SiC-based OBC power conversion module for electric field applied to the environment-friendly high temperature bonding material of the present invention, "Base plate; A direct bonded copper (DBC) substrate bonded to an upper surface of the base plate; Silicon carbide (SiC) chips bonded to an upper surface of the DBC substrate; And OBC power conversion module comprising a bonding wire for electrically connecting the DBC substrate and the silicon carbide chip, The base plate and the DBC substrate and the bonding material of the DBC substrate and silicon carbide (SiC) chip is limited to Sn-Sb-Cu Soldering, In the Sn-Sb-Cu Soldering, the SiC-based OBC power conversion module for electric field applied to the environment-friendly high-temperature bonding material limited to the weight ratio of Cu in the range of 0.5 to 1%, An output terminal and a terminal terminal are additionally provided on both sides or one side of an upper surface of the OBC power conversion module, wherein the output terminal and the terminal terminal are formed at an obtuse angle with the DBC substrate 135 degrees upward while being grounded to the DBC substrate. Eco-friendly high-temperature junction material applied electronic SiC-based OBC power conversion module "by its constituent features, The present invention as described above, Responding to ELV regulations With the development of eco-friendly automotive power conversion module based on high temperature / high durability SiC semiconductor device bonding technology, SiC power chip, DBC (Direct Bond Copper), Aluminum Wire, Low power bonding technology considering heat dissipation of components such as Base Plate, Molding Silicone, Case & Cover, and Terminal, that is, high heat resistance bonding between parts to develop high heat / high durability power conversion module for eco-friendly cars that do not dissolve under high temperature / high current conditions The effect of providing technology and joint introduction.