CHALLENGES OF AUTOMOTIVE ELECTRONICS MINIATURIZATION

摘要

The demand for advanced functionality and increased sensor technology in automotive systems is driving the continuing trend towards miniaturisation. Higher density interconnection (HDI), more complex component technology and increasing component population places new challenges on the electronics assembly. These technological challenges need to be considered from the first stages of the product development life cycle. Along with technological challenges, the higher automotive safety classification increases the harshness of environmental test conditions to achieve the required reliability with different service life use cases.