New Solder Paste from Heraeus Enables Further Reliable Miniaturization in Automotive Electronics

摘要

HANAU, Germany - Heraeus Electronics, a leading provider of materials solutions, has developed Microbond SMT650, its new solder paste that meets the extremely high requirements for production of miniaturized electrical systems, such as those used in the automotive industry. Microbond SMT650 guarantees consistently high surface resistance. The combination of the new F650 flux system with the Innolot metal alloy increases reliability and prevents electrochemical migration even under the most extreme environmental conditions.