MOLDING FOR USE IN MINIATURE ELECTRONIC COMPONENT HOLDING/CONVEYING JIG ETC., MINIATURE ELECTRONIC COMPONENT HOLDING/CONVEYING JIG USING THE SAME, AND MANUFACTURING METHOD THEREFOR

摘要

PPROBLEM TO BE SOLVED: To provide a molding for use in a miniature electronic component holding/conveying jig etc., which enables alignment by an inexpensive and simple method and enables the easy removal of the misaligned miniature electronic component. PSOLUTION: This molding is characterized in that an adhesive part and a non-adhesive part are formed in arbitrary shapes in arbitrary places on a flat plate-like surface. Preferably, at least a surface layer is composed of silicone rubber, and the molding is composed of at least two layers, that is, the silicone rubber surface layer with adhesion and a base layer of a material more rigid than the silicone rubber surface layer. In a manufacturing method, oxidation treatment is partially applied to the surface of the silicone rubber layer with the adhesion, and an oxidatively treated part is converted into the non-adhesive part. In the oxidation treatment, a chemical change and the like are caused by utilizing active oxygen which is generated by any one of ultraviolet irradiation treatment, corona discharge treatment, plasma discharge treatment and ozone atmosphere treatment. In the ultraviolet irradiation treatment, preferably, an ultraviolet irradiation dose is in a range of 1,000-20,000 mJ/cmSP2/SP. PCOPYRIGHT: (C)2004,JPO&NCIPI