ball grid arrays; bismuth alloys; nanoparticles; silver alloys; solders; tin alloys; CNTs-doped solder paste; IMCs; SnBiAg; aging; ball shear test; mechanical properties; mechanical stirring; nanoparticle reinforced lead-free BGA solder joints; nanoparticle reinforced solder joint phenomenon degradation; quantitative experiment loss; redistribution phenomenon detection; solder ball; solder flux outward flow; time 100 h; Aging; Degradation; Lead; Mechanical factors; Nanoparticles; Soldering;
机译:陶瓷纳米粒子增强Sn3.0Ag0.5Cu锡膏的无铅焊点的形貌和剪切强度
机译:回流焊接工艺冷却阶段中焊点排列方式对BGA无铅可靠性的影响
机译:使用无铅焊料的μBGA焊点可靠性研究
机译:纳米颗粒增强无铅BGA焊点的缺点
机译:重复机械跌落载荷作用下无铅BGA焊点失效机理的建模和寿命预测。
机译:使用Sn纳米粒子增强焊膏焊接无源部件:对微观结构和关节强度的影响
机译:建立对BGA封装中无铅焊点的影响力的估计方法(1)抗衰式焊接损失模式的依赖性损失载荷株的依赖性损失载荷株对PWB菌株的影响