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S3-P3: Advanced no-field-plate AlGaN/GaN hemts for millimeter-wave MMIC applications

机译:S3-P3:用于毫米波MMIC应用的高级无现场板AlGaN / GaN Hemts

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We report successful development of an advanced no-field-plate AlGaN/GaN high electron mobility transistors (HEMTs) for millimeter-wave (MMW) applications. The HEMT adopts a reduced source-drain spacing of 2 μm and the 0.2-μm gate is placed 0.5 μm off the source electrode. Additionally, the devices and monolithic microwave integrated circuits (MMICs) are fabricated on the SiC substrate of 2mil, enabling the fabrication of 15 μm × 25 μm slot via holes for realizing low inductance and more compact devices to facilitate MMW MMIC design. As a result, the narrow band MMICs have achieved an output power of 10.4 W with associated power added efficiency (PAE) of 31% at 28 GHz, and 10.7W and 27% at 36 GHz, respectively. Besides, a state-of-the-art 2-stage single-ended wideband MMIC demonstrates output power of 5–7.9 W and associated PAE of 13–21% from low K-band to high Ka-band.
机译:我们报告了毫米波(MMW)应用的先进无现场板AlGaN / GaN高电子移动晶体管(HEMT)的成功开发。 HEMT采用2μm的源极 - 漏极间距,0.2-μm栅极从源电极放置0.5μm。 另外,装置和单片微波集成电路(MMIC)在2mil的SiC基板上制造,使得通过孔的制造15μm×25μm槽,用于实现低电感和更紧凑的装置,以便于MMW MMIC设计。 结果,窄带MMIC在10.4W的输出功率分别实现了10.4W的输出功率,其中相关的功率增加了31%,分别为10.7W和27%,在36 GHz下。 此外,最先进的2级单端宽带MMIC显示出5-7.9W的输出功率和相关的PAE从低k波段到高KA波段的13-21%。

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