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Towards High-Volume Manufacturing of Logic Devices Using EUV Lithography - (PPT)

机译:使用EUV光刻 - (PPT)对逻辑器件的高批量生产

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Challenges in EUV Mask Repair - Deposition. Need accurate 3-D profile control of deposited area. Need image verification by actinic AIMS tool. Actinic Mask Metrology Tools Required for HVM User funding of NRE is necessary. Actinic BI, AIMS, and PMI tools are required for HVM of EUV masks Consensus by SEMATECH EUV Mask TWG. User funding of NRE is required in order to build these tools in time Consensus by SEMATECH EUV Mask BWG.
机译:EUV面膜修复挑战 - 沉积。需要精确的沉积区域的3-D型材控制。需要通过散步AIMS工具进行图像验证。 HVM用户资助NRE所需的Actinic Mask Metrology工具是必要的。 EUV Masks Consens的HVM由Sematech EUV面膜TWG共识。 NRE的用户资助是必需的,以便通过Sematech EUV Mask BWG建立这些工具。

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