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Electrical properties of polycrystalline p-Cu_xO MOS capacitors with SiO_2/HfO_2 high κ stack gate dielectric on Silicon substrate

机译:用SiO_2 / HFO_2高κ叠栅电介质在硅衬底上的多晶P-CU_XO MOS电容的电性能

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Polycrystalline p-type Cu_xO film was deposited after growth of HfO_2 dielectric on Si substrate by pulsed laser deposition, and Cu_xO MOS capacitors with SiO_2/HfO_2 stack gate dielectric have been primarily fabricated and investigated. Results of measurements indicate that capacitance equivalent thickness and equivalent κ-value of SiO_2/HfO_2 stack dielectric for post-deposition annealing (PDA) sample are 4.78 nm and 10.2 respectively, and gate leakage current density is ~10~(-4) A/cm~2 at V_g = -1 V. Results also show that PDA can improve quality of interface and reduce gate leakage.
机译:通过脉冲激光沉积在Si衬底上生长在Si衬底上的HFO_2电介质的生长之后沉积多晶p型Cu_XO膜,并且已经主要制造和研究了具有SiO_2 / HFO_2堆叠栅极电介质的CU_XO MOS电容。测量结果表明,用于沉积后退火(PDA)样品的SiO_2 / HFO_2堆叠电介质的电容等效厚度和等效κ值分别为4.78nm和10.2,栅极漏电流密度为约10〜(4)A / V_G = -1 V的CM〜2。结果还表明PDA可以提高界面质量并减少栅极泄漏。

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