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Discussion of origins of high-density trap states in SIMOX wafers

机译:SIMOX晶片中高密度陷阱状态的起源探讨

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We have demonstrated that separation by implanted oxygen (SIMOX) wafers have high-density trap states in silicon-on-insulator (SOI) layer, which are distributed within about 30 nm from the SOI/buried oxide (BOX) interface in the SOI layer, nano-scale roughness at SOI/BOX interface, and local stress near SOI/BOX interface. Meanwhile, it is reported by Bjorkman et al. that there is a correlation between the stress in the SiO_2 layer and the Si/SiO_2 interface state density at midgap. From these results, we elucidate mutual relationships between trap states, roughness, and local stress. We discuss origin of the high-density trap states from a point of the local stress.
机译:我们已经证明,植入氧气(SIMOX)晶片的分离在绝缘体上具有高密度陷阱状态,其在硅上的硅上(SOI)层中,从SOI层中的SOI /掩埋氧化物(盒)接口分布在约30nm内,SOI /箱界面的纳米尺度粗糙度,以及SOI /箱界面附近的局部应力。同时,Bjorkman等人报道。 SiO_2层中的应力与中间图中的Si / SiO_2接口状态密度之间存在相关性。从这些结果来看,我们阐明陷阱状态,粗糙度和局部压力之间的相互关系。我们从局部压力的点讨论高密度陷阱状态的起源。

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