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MECHANISM STUDY OF HOT CARRIER INDUCED DEGRADATION IN LDMOSFET

机译:热载体诱导LDMOSFET降解的机制研究

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Hot Carrier Injection (HCI) behaviors of the two types of LDMOS were investigated in this paper, The inverse degradation behavior of linear drive current and channel transconductance between the two device configurations were characterized, The possible mechanisms were discussed by detailed electric measurement and thorough analysis. Charge pumping measurements and TCAD simulations were performed to verify the channel electric field distribution and the drastic carrier impact ionization zone. The results turn out that with the change of the overlap statues between the gate electrodes and the lateral diffused drift regions, the location of the maximum electric field changed and so did the impact ionization zone.
机译:本文研究了两种类型的LDMOS的热载体注射(HCI)行为,表征了两种装置配置之间的线性驱动电流和信道跨导的逆劣化行为,其特征在于,通过详细的电测量和彻底分析讨论了可能的机制。进行充电泵送测量和TCAD模拟以验证通道电场分布和激烈载波冲击电离区。结果表明,随着栅极电极和横向扩散漂移区之间的重叠雕像的变化,最大电场的位置变化,碰撞电离区也是如此。

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