Both reflection mode and through transmission modes are useful to gain a thorough knowledge of the presence or absence of defects in the devices. The direction observed in the design and construction of stacked die devices suggests that in the future the internal dimensions of the layers and the number of layers will stress the capabilities of conventional AMI analysis. Larger stacks may rely more on through transmission than reflection mode AMI. Future work is underway to improve the analysis of larger stacks of thin die using mathematical methods and sophisticated A-Scan waveform simulators.
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