Application of Acoustic Frequency Domain Imaging for the Evaluation of Advanced Micro Electronic Packages

摘要

Acoustic Micro Imaging (AMI) has been used for years to evaluate microelectronic packages for the presence of internal defects. The drive in micro electronic packaging is to reduce the size of the components as much as possible to keep pace with the shrinking size of the end products. This leads to smaller/thinner packages with internal features and possibly defects that are approaching the resolution limits for conventional AMI. Recently AMI has been combined with Fourier transforms of the acoustic signal to produce frequency domain images.