Thermal Characterization of Copper Contact Interconnect for DRAM Package Stacking - (PPT)

摘要

μPILR 3D stack enables memory modules with high density and low profile; Compared to solder ball interconnect, μPILR stacked package has higher thermal conductivity, shorter heat transfer path, higher pin count, which benefits heat transfer, even at reduced cross section area; When DIMMs are placed in parallel, as in server application, μPILR performs better since the memory module is thinner, and enables more efficient air cooling.