Sub-30 nm FinFETs with Schottky-Barrier Source/Drain Featuring Complementary Metal Silicides and Fully-Silicided Gate for P-FinFETs

摘要

We investigated the material and electrical characteristics of platinum and ytterbium silicides for potential applications as metallic Schottky-barrier source/drain (S/D) and fully-silicided (FUSI) gate electrodes in fin field-effect transistors (FinFETs). Due to the low electro-negativity parameter of ytterbium, a low temperature silicidation process was developed to avoid the reaction of ytterbium with the isolation regions (i.e. SiO{sub}2 and SiN) to integrate ytterbium silicide successfully in mesa-isolated n-FinFETs. The integration of FUSI metal gate into p-FinFETs was also explored in this work and a novel two-step silicidation process that integrates simultaneously two different phases of platinum silicide with the appropriate work function values for gate electrode and source/drain application was demonstrated.