Miniaturization has been, and continues to be. a challenge for the electronics industry. Assemblies are getting more complex, component spacing is decreasing, and circuit board real estate is quickly becoming a premium commodity. Board assemblers are currently investing many resources to prove that circuit boards for future challenges can be built. The 1990s revealed the 0402. the 2000s created the 0201 component, and the 2010s introduced the 01005; all of this yielded the 008004, with each new component saving more and more space. Currently, the mobile communications market is using these small components and other industries are quickly catching up. As component size decreases, material suppliers have to develop next generation materials and processes to meet the industry's needs. This paper will investigate the effect of powder size on the transfer efficiency of solder paste. Five different powder sizes will be homogeneously mixed within the same flux vehicle to yield five different solder paste systems. Each system will be evaluated to provide the optimum print conditions for the 008004 apertures and pad design. All of the powder sizes will then be compared to each other to determine the appropriate powder size distribution.
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