Sublimation of Two Dicarboxylic Acids Used in Solder Pastes

摘要

Our industry is slowly coming to the realization that many fluxes containing low molecular weight carboxylic acids cannot be adequately tested for surface insulation resistance and electrochemical migration at high temperatures. This paper describes the use of thermal gravimetric analysis (TGA) to look at the sublimation of succinic acid and glutaric acid from a paste flux formulation.