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Highly tensile strained silicon carbon phosphorus alloys epitaxially grown into recessed source drain areas of NMOS devices

机译:高度拉伸硅碳磷合金外延生长到NMOS器件的凹陷源漏区

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Growth rates up to 82 nm/min (at 550/spl deg/C) led to films incorporating up to 3.6% substitutional carbon according to Vegard's law; (2.8% after (Kelires, 1998)) and an /spl alpha//epi growth rate ratio of 1. The films were fully strained with perpendicular lattice constants of down to 5.363 /spl Aring/ and displayed stress well above 2 GPa. Moreover, these films could be heavily doped with P and led to resistivities as low as 0.5 - 1.5 m/spl Omega/cm.
机译:增长率高达82 nm / min(550 / spl deg / c)导致薄膜根据vegard的法律掺入3.6%的替代碳; (2.8%(Kelires,1998)之后)和/ SPLα// EPI生长速率比为1.薄膜用下降至5.363 / SPL的垂直晶格常数完全应变/并显示出高于2GPa。此外,这些薄膜可以很大掺杂P,并导致低至0.5-1.5M / SPLω/ cm的电阻。

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