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Highly tensile strained silicon carbon phosphorus alloys epitaxially grown into recessed source drain areas of NMOS devices

机译:高张力应变硅碳磷合金外延生长到NMOS器件的凹陷源漏区中

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Growth rates up to 82 nm/min (at 550/spl deg/C) led to films incorporating up to 3.6% substitutional carbon according to Vegard's law; (2.8% after (Kelires, 1998)) and an /spl alpha//epi growth rate ratio of 1. The films were fully strained with perpendicular lattice constants of down to 5.363 /spl Aring/ and displayed stress well above 2 GPa. Moreover, these films could be heavily doped with P and led to resistivities as low as 0.5 - 1.5 m/spl Omega/cm.
机译:根据Vegard定律,高达82 nm / min的生长速率(在550 / spl deg / C下)导致薄膜中掺入高达3.6%的取代碳; (2.8%,之后(Kelires,1998))和/ splα// epi生长速率比为1。膜以垂直晶格常数低至5.363 / spl Aring /充分应变,并显示出远高于2 GPa的应力。此外,这些膜可能会严重掺入P,导致电阻率低至0.5-1.5 m / splΩ/ cm。

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