A Novel Method for Sequentially-building Multi-layer Circuits using LCP Laminates, Cap-layers and Bond Plys

摘要

Development efforts at Rogers are continuing on R/flex LCP materials for printed circuit production. As an extension of our EIPC Spring 2003 paper, work has been completed on a novel method for sequentially building multi-layer circuit boards using our laminates, bond plys and cap layers manufactured from various melt-point LCP dielectric films. This paper will discuss the theory and practice of sequentially built multilayers in all-LCP and mixed dielectric constructions, review the pertinent processing steps and guidelines necessary for production and subsequent assembly thereafter, and consider some of the application areas that may benefit from this novel fabrication strategy.