ball grid arrays; integrated circuit reliability; soldering; optimisation; Young's modulus; thermal expansion; finite automata; finite element analysis; response surface methodology; evolutionary computation; Monte Carlo methods; solder joint thermomechanical reliability; land grid array solder joints; LGA package design optimization; deterministic optimization method; land ball array; temperature cycling; printed wiring board thickness; Young's modulus; coefficient of thermal expansion; solder joint plastic work per temperature cycle; finite element simulations; response surface approximation; differential evolution algorithm; quasi-Monte Carlo method; probability analysis;
机译:用于在印刷电路板(PCB)上焊接的球栅阵列(BGA)中焊点的热机械可靠性的有效焊料
机译:无铅焊锡材料和焊锡掩模尺寸不同设计的倒装芯片球栅阵列元件的焊点可靠性评估
机译:无铅焊锡材料和焊锡掩模尺寸不同设计的倒装芯片球栅阵列元件的焊点可靠性评估
机译:陆栅阵列焊点热机械可靠性的设计优化方法
机译:保形涂料对球栅阵列焊点长期可靠性的影响
机译:锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
机译:抗冲击载荷下球栅阵列型包装中无铅焊点可靠性的设计方法