An apparatus and system are provided for improving ball grid array (BGA) joint reliability. According to one embodiment, a ball grid array (BGA) package having a first and second surface and an array of solder balls to align the first surface with the second surface is disclosed. The first surface is coupled to an integrated circuit (IC) device and the second surface is coupled to a printed circuit board (PCB). A bonder is applied between the first surface and second surface independently of the array of solder balls.
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