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International Conference on the Business of Electronic Product Reliability and Liability
International Conference on the Business of Electronic Product Reliability and Liability
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1.
Effects of electromigration on IMC evolution in Pb-free solder joints
机译：
电迁移对可口PB的IMC演化的影响
作者：
Wang Lei
;
Wu Fengshun
;
Zhang Jinsong
;
An Bing
;
Wu Yiping
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
alloys;
solders;
electromigration;
voids (solid);
crystal morphology;
ageing;
reflow soldering;
IMC evolution;
Pb-free solder joints;
electromigration;
electronics reliability;
void formation;
void propagation;
pileup formation;
hillock formation;
intermetallic compound morphology variations;
thermal aging;
reflow cycles;
2.
Effects of electromigration on IMC evolution in Pb-free solder joints
机译：
电迁移对可口PB的IMC演化的影响
作者：
Wang Lei
;
Wu Fengshun
;
Zhang Jinsong
;
An Bing
;
Wu Yiping
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
alloys;
solders;
electromigration;
voids (solid);
crystal morphology;
ageing;
reflow soldering;
IMC evolution;
Pb-free solder joints;
electromigration;
electronics reliability;
void formation;
void propagation;
pileup formation;
hillock formation;
intermetallic compound morphology variations;
thermal aging;
reflow cycles;
3.
Analysis on altimeters' reliability growth test data
机译：
高度计可靠性增长测试数据分析
作者：
Wenhua Mei
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
altimeters;
reliability;
failure analysis;
statistical analysis;
altimeter reliability;
reliability growth test data;
multiple item development AMSAA model;
altimeter failure data analysis;
statistical analysis;
MTBF confidence lower limit;
4.
Analysis on altimeters' reliability growth test data
机译：
高度计可靠性增长测试数据分析
作者：
Wenhua Mei
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
altimeters;
reliability;
failure analysis;
statistical analysis;
altimeter reliability;
reliability growth test data;
multiple item development AMSAA model;
altimeter failure data analysis;
statistical analysis;
MTBF confidence lower limit;
5.
Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure
机译：
高温曝光期间Cu衬底上的Sn-3.5Ag焊料和电镀Ni层之间的微观结构和界面反应
作者：
Duan L.L.
;
Yu D.Q.
;
Han S.Q.
;
Zhao J.
;
Wang L.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
solders;
crystal microstructure;
electroplated coatings;
thermal stresses;
diffusion;
soldering;
ageing;
tin alloys;
silver alloys;
tin;
copper;
microstructure;
solder/electroplated layer interface reaction;
high temperature exposure;
solder/substrate inter-diffusion;
soldering;
aging;
intermetallic compound;
IMC layer growth kinetic;
activation energy;
lead-free solder;
electroplated Ni plating;
1000 h;
70 degC;
120 degC;
170 degC;
SnAg-Ni-Cu;
Ni/sub 3/Sn/sub 4/;
Cu/sub 6/Sn/sub 5/;
Ag/sub 3/Sn;
6.
Study on plasma cleaning and strength of wire bonding
机译：
浆液清洗和引线强度的研究
作者：
Guan Rongfeng
;
Wang Xuefang
;
Zhu Fulong
;
Gan Zhiyin
;
Liu Sheng
;
Huang Dexiu
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
surface cleaning;
lead bonding;
plasma materials processing;
electronics packaging;
plasma cleaning;
wire bonding strength;
IC packaging processing;
MEMS packaging processing;
cleaning process parameters;
gas pressure;
RF power;
cleaning time;
cleaning gas;
wire bonding pull tests;
ground electrode;
anode;
process parameter optimization;
200 to 600 W;
10 to 15 min;
7.
Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure
机译：
高温曝光期间Cu衬底上的Sn-3.5Ag焊料和电镀Ni层之间的微观结构和界面反应
作者：
Duan L.L.
;
Yu D.Q.
;
Han S.Q.
;
Zhao J.
;
Wang L.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
solders;
crystal microstructure;
electroplated coatings;
thermal stresses;
diffusion;
soldering;
ageing;
tin alloys;
silver alloys;
tin;
copper;
microstructure;
solder/electroplated layer interface reaction;
high temperature exposure;
solder/substrate inter-diffusion;
soldering;
aging;
intermetallic compound;
IMC layer growth kinetic;
activation energy;
lead-free solder;
electroplated Ni plating;
1000 h;
70 degC;
120 degC;
170 degC;
SnAg-Ni-Cu;
Ni/sub 3/Sn/sub 4/;
Cu/sub 6/Sn/sub 5/;
Ag/sub 3/Sn;
8.
Generalized step stress accelerated life model LED case study
机译：
广义步骤应力加速寿命模型LED案例研究
作者：
Wenbiao Zhao
;
Mettas A.
;
Xiaolong Zhao
;
Vassiliou P.
;
Elsayed E.A.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
life testing;
light emitting diodes;
semiconductor device testing;
semiconductor device models;
semiconductor device reliability;
maximum likelihood estimation;
statistical distributions;
maximum likelihood estimation method;
generalized accelerated life model;
LED testing;
step stress testing;
general likelihood function;
step stress models;
reliability analysis;
multiple-stress testing data;
profiled testing data;
Nelson cumulative damage model;
Gouno model;
Xiong-Milliken model;
life distribution;
ALT;
generalized linear model;
9.
Generalized step stress accelerated life model LED case study
机译：
广义步骤应力加速寿命模型LED案例研究
作者：
Wenbiao Zhao
;
Mettas A.
;
Xiaolong Zhao
;
Vassiliou P.
;
Elsayed E.A.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
life testing;
light emitting diodes;
semiconductor device testing;
semiconductor device models;
semiconductor device reliability;
maximum likelihood estimation;
statistical distributions;
maximum likelihood estimation method;
generalized accelerated life model;
LED testing;
step stress testing;
general likelihood function;
step stress models;
reliability analysis;
multiple-stress testing data;
profiled testing data;
Nelson cumulative damage model;
Gouno model;
Xiong-Milliken model;
life distribution;
ALT;
generalized linear model;
10.
The evaluation of the new composite lead free solders with the novel fabricating process
机译：
用新型制造过程评价新型复合铅免焊料
作者：
Wang L.
;
Yu D.Q.
;
Han S.Q.
;
Ma H.T.
;
Xie H.P.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
tin alloys;
silver alloys;
copper alloys;
yttrium compounds;
solders;
particle reinforced composites;
surface mount technology;
crystal microstructure;
shear strength;
wetting;
composite lead free solders;
surface mount technology;
reinforcement particles;
RMA flux;
solder paste;
composite solder microstructure;
rare earth oxides;
solder joint shear strength;
lead free solder;
solder wetting properties;
SnAgCu;
Y/sub 2/O/sub 3/;
11.
The evaluation of the new composite lead free solders with the novel fabricating process
机译：
用新型制造过程评价新型复合铅免焊料
作者：
Wang L.
;
Yu D.Q.
;
Han S.Q.
;
Ma H.T.
;
Xie H.P.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
tin alloys;
silver alloys;
copper alloys;
yttrium compounds;
solders;
particle reinforced composites;
surface mount technology;
crystal microstructure;
shear strength;
wetting;
composite lead free solders;
surface mount technology;
reinforcement particles;
RMA flux;
solder paste;
composite solder microstructure;
rare earth oxides;
solder joint shear strength;
lead free solder;
solder wetting properties;
SnAgCu;
Y/sub 2/O/sub 3/;
12.
Study on plasma cleaning and strength of wire bonding
机译：
浆液清洗和引线强度的研究
作者：
Guan Rongfeng
;
Wang Xuefang
;
Zhu Fulong
;
Gan Zhiyin
;
Liu Sheng
;
Huang Dexiu
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
surface cleaning;
lead bonding;
plasma materials processing;
electronics packaging;
plasma cleaning;
wire bonding strength;
IC packaging processing;
MEMS packaging processing;
cleaning process parameters;
gas pressure;
RF power;
cleaning time;
cleaning gas;
wire bonding pull tests;
ground electrode;
anode;
process parameter optimization;
200 to 600 W;
10 to 15 min;
13.
Astronautic PBGA (plastic ball grid array) solder joints' reliability: under successive-high acceleration shock condition
机译：
宇航员PBGA（塑料球栅阵列）焊点可靠性：在连续高加速度休克条件下
作者：
Qiang Guo
;
Mei Zhao
;
Zhen-jun Zhu
;
Xiao-chang Zhang
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
integrated circuit reliability;
surface mount technology;
integrated circuit packaging;
ball grid arrays;
plastic packaging;
stress analysis;
thermal shock;
soldering;
assembling;
space vehicle electronics;
thermal stress cracking;
scanning electron microscopy;
mechanical testing;
astronautic PBGA;
plastic ball grid array;
solder joint reliability;
high acceleration shock condition;
astronautic industry;
SMT solder joints;
missile;
rocket;
astronautic environment;
astronautic PBGA256 assembly;
IMC thickness;
growth rate;
Cu/sub 6/Sn/sub 5//Cu/sub 3/Sn phase growth rate;
Ag/sub 3/Sn phase growth rate;
final micrographs;
crack;
SEM;
solder joint phenomena;
thermal fatigue load;
3 hr;
Cu/sub 6/Sn/sub 5/-Cu/sub 3/Sn;
Ag/sub 3/Sn;
14.
Astronautic PBGA (plastic ball grid array) solder joints' reliability: under successive-high acceleration shock condition
机译：
宇航员PBGA（塑料球栅阵列）焊点可靠性：在连续高加速度休克条件下
作者：
Qiang Guo
;
Mei Zhao
;
Zhen-jun Zhu
;
Xiao-chang Zhang
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
integrated circuit reliability;
surface mount technology;
integrated circuit packaging;
ball grid arrays;
plastic packaging;
stress analysis;
thermal shock;
soldering;
assembling;
space vehicle electronics;
thermal stress cracking;
scanning electron microscopy;
mechanical testing;
astronautic PBGA;
plastic ball grid array;
solder joint reliability;
high acceleration shock condition;
astronautic industry;
SMT solder joints;
missile;
rocket;
astronautic environment;
astronautic PBGA256 assembly;
IMC thickness;
growth rate;
Cu/sub 6/Sn/sub 5//Cu/sub 3/Sn phase growth rate;
Ag/sub 3/Sn phase growth rate;
final micrographs;
crack;
SEM;
solder joint phenomena;
thermal fatigue load;
3 hr;
Cu/sub 6/Sn/sub 5/-Cu/sub 3/Sn;
Ag/sub 3/Sn;
15.
Lifetime of solder joint and delamination in flip chip assemblies
机译：
焊接芯片组件中的焊接接头和分层的寿命
作者：
Zhaonian Cheng
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
finite element analysis;
acoustic microscopy;
soldering;
flip-chip devices;
delamination;
life testing;
fatigue cracks;
tin alloys;
lead alloys;
elasticity;
viscoelasticity;
reliability;
solder joint lifetime;
flip chip assembly delamination;
solder underfill;
type B flip chip package;
type D flip chip package;
thermomechanical behavior;
thermal fatigue lifetime;
solder joint reliability;
C-mode scanning acoustic microscope;
C-SAM inspection;
package deformation mode;
delamination crack length;
plastic strain range;
shear direction displacement;
maximum plastic strain range;
underfill material models;
constant elasticity;
temperature dependent elasticity;
viscoelasticity;
fractured solder joint;
Paris half-empirical equation;
fine solder joint;
delamination propagation rates;
strain energy release rates;
Coffin-Manson equation;
bumping size;
stand-off height;
thermal cycling;
finite element simulation;
SnPb;
16.
Lifetime of solder joint and delamination in flip chip assemblies
机译：
焊接芯片组件中的焊接接头和分层的寿命
作者：
Zhaonian Cheng
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
finite element analysis;
acoustic microscopy;
soldering;
flip-chip devices;
delamination;
life testing;
fatigue cracks;
tin alloys;
lead alloys;
elasticity;
viscoelasticity;
reliability;
solder joint lifetime;
flip chip assembly delamination;
solder underfill;
type B flip chip package;
type D flip chip package;
thermomechanical behavior;
thermal fatigue lifetime;
solder joint reliability;
C-mode scanning acoustic microscope;
C-SAM inspection;
package deformation mode;
delamination crack length;
plastic strain range;
shear direction displacement;
maximum plastic strain range;
underfill material models;
constant elasticity;
temperature dependent elasticity;
viscoelasticity;
fractured solder joint;
Paris half-empirical equation;
fine solder joint;
delamination propagation rates;
strain energy release rates;
Coffin-Manson equation;
bumping size;
stand-off height;
thermal cycling;
finite element simulation;
SnPb;
17.
The role of TRIZ as an inventive tool in technology development and integration in China
机译：
TRIZ作为中国技术开发和整合的创造工具的作用
作者：
Lau D.K.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
problem solving;
product development;
product design;
innovation management;
reliability;
TRIZ innovation technology;
China;
product development;
product design;
reliability;
technology development;
business management;
Soviet initiated TRIZ;
S-curve profile;
product life cycle;
Geinrich Altshuller;
systematic innovation process;
Theory of Inventive Problem Solving;
problem solving strategies;
18.
A machine vision system of ball grid array inspection on RT-Linux OS
机译：
RT-Linux OS中球栅阵列检查机器视觉系统
作者：
Xia Nianjiong
;
Cao Qixin
;
Fu Zhuang
;
Jey Lee
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
ball grid arrays;
automatic optical inspection;
image processing;
computer vision;
operating systems (computers);
quality control;
threshold segmentation;
machine vision system;
ball grid array inspection;
RT-Linux OS;
BGA inspection;
binocular vision system;
solder ball quality monitoring;
optical lead coplanarity measurement method;
ball height;
ball size;
ball pitch;
real-time inspection;
real-time image processing;
geometrical relationship;
19.
Using 6σ to Supervise Product Innovation Process Based on Knowledge Management — A Case Introduction of an LCD Cooperation in Taiwan
机译：
使用6σ根据知识管理监督产品创新过程 - 以台湾液晶合作引入
作者：
Chin-Min Wu
;
Yun-Kung Chung
;
Surface Mount Technology(Holdings) Limited
;
Compass Technology Company Limited
;
Mobicon Electronic Components
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
knowledge management;
6 sigma;
product innovation;
quality control;
20.
Green molding compounds for high temperature automotive applications
机译：
用于高温汽车应用的绿色成型化合物
作者：
Gallo A.A.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
automotive electronics;
electronics packaging;
plastic packaging;
gold;
aluminium;
reliability;
high-temperature electronics;
moulding;
transition metal compounds;
flame retardants;
plastic packages;
gold wire/aluminium bonding pad interface;
high temperature reliability;
green molding compounds;
high temperature automotive applications;
automotive power devices;
wire bond interface degradation;
interface resistance;
transition metal oxide flame retardants;
200 degC;
20000 hour;
Au;
Al;
21.
Implementation of an enhanced FMEA system for the PCBA design testing - a practical case study failure mode and effects analysis
机译：
实现PCBA设计测试增强的FMEA系统 - 一种实用案例研究失效模式和效果分析
作者：
Chen T.T.
;
Yun-shiow Chen
;
Yun-Kung Chung
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
printed circuit testing;
printed circuit design;
design for testability;
failure analysis;
quality control;
process control;
macros;
spreadsheet programs;
CAD/CAM;
DFT;
failure mode effects analysis;
PCBA design testing;
printed circuit board assembly testing;
current engineering;
E-FMEA system;
quality control;
descriptive rules;
VBA macroinstructions;
Excel spreadsheet;
reliability;
CAD/CAM;
22.
SMT solder joint's shape and location optimization using modified genetic algorithm in the dynamic loadings
机译：
SMT焊接接头的形状和位置优化在动态负载中使用改进的遗传算法
作者：
Ling-yun Wei
;
Mei Zhao
;
Qiang Guo
;
Xiao-chang Zhang
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
surface mount technology;
stress-strain relations;
fatigue;
soldering;
finite element analysis;
genetic algorithms;
reliability;
ball grid arrays;
surface mount technology;
modified genetic algorithm;
solder joint reliability;
solder joint lifetime;
modal experiment;
SMT;
vibration fatigue;
solder joint shape optimization;
solder joint location optimization;
shock conditions;
finite element model;
PBGA256 assembly;
FEM;
solder joint strain;
dynamic loadings;
23.
Fabrication of smart card using UV curable anisotropic conductive adhesive (ACA) part II: reliability performance of the ACA joints
机译：
使用UV可固化各向异性导电粘合剂（ACA）第II部分：ACA关节的可靠性性能的制造
作者：
Tan C.W.
;
Siu Y.M.
;
Lee K.K.
;
Chan Y.C.
;
Cheng L.M.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
curing;
shear strength;
integrated circuit reliability;
integrated circuit packaging;
thermal analysis;
thermal stresses;
scanning electron microscopy;
Fourier transform spectra;
spectrochemical analysis;
failure analysis;
adhesives;
conducting polymers;
plastic packaging;
smart cards;
chip-on-board packaging;
fracture;
environmental degradation;
smart card fabrication;
UV curable anisotropic conductive adhesive;
ACA joint reliability performance;
mobile electronic products;
mechanical attacks;
environmental attacks;
warps;
stretching;
humidity;
temperature change;
reliability;
chip-on-flex bonding;
UV curable ACA joint;
COF;
contactless smart card samples;
autoclave test;
failure mechanisms;
reading distance;
test interval;
shear strength;
fracture surfaces;
SEM;
aged ACA joint samples;
bare ACA specimens;
curing conditions;
chemical FTIR-ATR analysis;
chemical structure change;
24.
Reliability of flip-chip interconnect for fine pitch applications
机译：
细距应用倒装芯片互连的可靠性
作者：
Bailey C.
;
Stoyanov S.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
flip-chip devices;
integrated circuit interconnections;
fine-pitch technology;
chip scale packaging;
finite element analysis;
adhesive bonding;
reliability;
flip-chip interconnect reliability;
fine pitch applications;
finite element modelling;
chip scale packaging;
CSP;
isotropic conductive adhesives;
underfill properties;
I/O per square die area;
package design;
board assembly;
flip-chip manufacture;
25.
The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process
机译：
BI对老化过程中SN-3AG-0.5CU焊接界面IMC生长的影响
作者：
Lin Qi
;
Jie Zhao
;
Xiu-min Wang
;
Lai Wang
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
solders;
tin alloys;
silver alloys;
copper alloys;
bismuth alloys;
eutectic alloys;
ageing;
crystal microstructure;
crystal morphology;
diffusion;
lead-free solder;
IMC growth rate sequence;
solder interface;
isothermal solder joint aging process;
eutectic solder;
quaternary solder;
microstructure evolution;
IMC growth kinetics;
resistance oven;
scallop-like morphology;
planar morphology;
atom diffusion;
145 to 155 degC;
50 hour;
100 hour;
250 hour;
500 hour;
1000 hour;
SnAgCu;
SnAgCuBi;
26.
Using 6/spl sigma/ to supervise product innovation process based on knowledge management - a case introduction of an LCD cooperation in Taiwan
机译：
使用6 / SPL SIGMA /根据知识管理监督产品创新过程 - 以台湾液晶合作介绍
作者：
Chin-Min Wu
;
Yun-Kung Chung
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
knowledge management;
liquid crystal displays;
research and development management;
product development;
electronic equipment manufacture;
quality control;
product innovation process;
knowledge management;
LCD cooperation case introduction;
product development experience;
design data;
production renovation;
product development time;
product production cost;
past product Ramp;
D knowledge;
new product Ramp;
D process;
six-sigma quality supervision mechanism;
local markets;
global markets;
complementary functions;
large-scale LCD firm;
Taiwan;
quality control;
27.
Reliability of flip-chip interconnect for fine pitch applications
机译：
细距应用倒装芯片互连的可靠性
作者：
Bailey C.
;
Stoyanov S.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
flip-chip devices;
integrated circuit interconnections;
fine-pitch technology;
chip scale packaging;
finite element analysis;
adhesive bonding;
reliability;
flip-chip interconnect reliability;
fine pitch applications;
finite element modelling;
chip scale packaging;
CSP;
isotropic conductive adhesives;
underfill properties;
I/O per square die area;
package design;
board assembly;
flip-chip manufacture;
28.
The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process
机译：
BI对老化过程中SN-3AG-0.5CU焊接界面IMC生长的影响
作者：
Lin Qi
;
Jie Zhao
;
Xiu-min Wang
;
Lai Wang
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
solders;
tin alloys;
silver alloys;
copper alloys;
bismuth alloys;
eutectic alloys;
ageing;
crystal microstructure;
crystal morphology;
diffusion;
lead-free solder;
IMC growth rate sequence;
solder interface;
isothermal solder joint aging process;
eutectic solder;
quaternary solder;
microstructure evolution;
IMC growth kinetics;
resistance oven;
scallop-like morphology;
planar morphology;
atom diffusion;
145 to 155 degC;
50 hour;
100 hour;
250 hour;
500 hour;
1000 hour;
SnAgCu;
SnAgCuBi;
29.
Using 6/spl sigma/ to supervise product innovation process based on knowledge management - a case introduction of an LCD cooperation in Taiwan
机译：
使用6 / SPL SIGMA /根据知识管理监督产品创新过程 - 以台湾液晶合作介绍
作者：
Chin-Min Wu
;
Yun-Kung Chung
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
knowledge management;
liquid crystal displays;
research and development management;
product development;
electronic equipment manufacture;
quality control;
product innovation process;
knowledge management;
LCD cooperation case introduction;
product development experience;
design data;
production renovation;
product development time;
product production cost;
past product Ramp;
D knowledge;
new product Ramp;
D process;
six-sigma quality supervision mechanism;
local markets;
global markets;
complementary functions;
large-scale LCD firm;
Taiwan;
quality control;
30.
Implementation of an enhanced FMEA system for the PCBA design testing - a practical case study failure mode and effects analysis
机译：
实现PCBA设计测试增强的FMEA系统 - 一种实用案例研究失效模式和效果分析
作者：
Chen T.T.
;
Yun-shiow Chen
;
Yun-Kung Chung
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
printed circuit testing;
printed circuit design;
design for testability;
failure analysis;
quality control;
process control;
macros;
spreadsheet programs;
CAD/CAM;
DFT;
failure mode effects analysis;
PCBA design testing;
printed circuit board assembly testing;
current engineering;
E-FMEA system;
quality control;
descriptive rules;
VBA macroinstructions;
Excel spreadsheet;
reliability;
CAD/CAM;
31.
SMT solder joint's shape and location optimization using modified genetic algorithm in the dynamic loadings
机译：
SMT焊接接头的形状和位置优化在动态负载中使用改进的遗传算法
作者：
Ling-yun Wei
;
Mei Zhao
;
Qiang Guo
;
Xiao-chang Zhang
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
surface mount technology;
stress-strain relations;
fatigue;
soldering;
finite element analysis;
genetic algorithms;
reliability;
ball grid arrays;
surface mount technology;
modified genetic algorithm;
solder joint reliability;
solder joint lifetime;
modal experiment;
SMT;
vibration fatigue;
solder joint shape optimization;
solder joint location optimization;
shock conditions;
finite element model;
PBGA256 assembly;
FEM;
solder joint strain;
dynamic loadings;
32.
The role of TRIZ as an inventive tool in technology development and integration in China
机译：
TRIZ作为中国技术开发和整合的创造工具的作用
作者：
Lau D.K.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
problem solving;
product development;
product design;
innovation management;
reliability;
TRIZ innovation technology;
China;
product development;
product design;
reliability;
technology development;
business management;
Soviet initiated TRIZ;
S-curve profile;
product life cycle;
Geinrich Altshuller;
systematic innovation process;
Theory of Inventive Problem Solving;
problem solving strategies;
33.
Green molding compounds for high temperature automotive applications
机译：
用于高温汽车应用的绿色成型化合物
作者：
Gallo A.A.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
automotive electronics;
electronics packaging;
plastic packaging;
gold;
aluminium;
reliability;
high-temperature electronics;
moulding;
transition metal compounds;
flame retardants;
plastic packages;
gold wire/aluminium bonding pad interface;
high temperature reliability;
green molding compounds;
high temperature automotive applications;
automotive power devices;
wire bond interface degradation;
interface resistance;
transition metal oxide flame retardants;
200 degC;
20000 hour;
Au;
Al;
34.
A machine vision system of ball grid array inspection on RT-Linux OS
机译：
RT-Linux OS中球栅阵列检查机器视觉系统
作者：
Xia Nianjiong
;
Cao Qixin
;
Fu Zhuang
;
Jey Lee
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
ball grid arrays;
automatic optical inspection;
image processing;
computer vision;
operating systems (computers);
quality control;
threshold segmentation;
machine vision system;
ball grid array inspection;
RT-Linux OS;
BGA inspection;
binocular vision system;
solder ball quality monitoring;
optical lead coplanarity measurement method;
ball height;
ball size;
ball pitch;
real-time inspection;
real-time image processing;
geometrical relationship;
35.
Accelerated testing and finite element analysis of PBGA under multiple environmental loadings
机译：
多种环境载荷下PBGA的加速测试与有限元分析
作者：
Haiyu Qi
;
Ganesan S.
;
Osterman M.
;
Pecht M.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
ball grid arrays;
plastic packaging;
thermal stresses;
life testing;
finite element analysis;
encapsulation;
integrated circuit packaging;
integrated circuit reliability;
failure analysis;
thermal cycling;
accelerated testing;
finite element analysis;
PBGA;
board level multiple environmental loading;
long term reliability;
plastic ball grid array packages;
aerospace applications;
nonunderfilled packages;
underfilled packages;
solder joint reliability;
failure mode analysis;
thermomechanical behavior;
cyclic thermal loading;
3D FEA;
time to failure;
36.
Accelerated testing and finite element analysis of PBGA under multiple environmental loadings
机译：
多种环境载荷下PBGA的加速测试与有限元分析
作者：
Haiyu Qi
;
Ganesan S.
;
Osterman M.
;
Pecht M.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
ball grid arrays;
plastic packaging;
thermal stresses;
life testing;
finite element analysis;
encapsulation;
integrated circuit packaging;
integrated circuit reliability;
failure analysis;
thermal cycling;
accelerated testing;
finite element analysis;
PBGA;
board level multiple environmental loading;
long term reliability;
plastic ball grid array packages;
aerospace applications;
nonunderfilled packages;
underfilled packages;
solder joint reliability;
failure mode analysis;
thermomechanical behavior;
cyclic thermal loading;
3D FEA;
time to failure;
37.
Study for safe operating area of high voltage LDMOS
机译：
高压LDMOS安全工作区的研究
作者：
Fang Jian
;
Li Zhaoji
;
Zhang Bo
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
power MOSFET;
semiconductor device models;
semiconductor device breakdown;
LDMOS safe operating area;
high voltage LDMOS;
on-state breakdown model;
RESURF LDMOS;
carrier drift velocity saturation;
parasitic bipolar transistor;
n-drift electric field profile;
SOA;
on-state device physics;
38.
Study for safe operating area of high voltage LDMOS
机译：
高压LDMOS安全工作区的研究
作者：
Fang Jian
;
Li Zhaoji
;
Zhang Bo
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
power MOSFET;
semiconductor device models;
semiconductor device breakdown;
LDMOS safe operating area;
high voltage LDMOS;
on-state breakdown model;
RESURF LDMOS;
carrier drift velocity saturation;
parasitic bipolar transistor;
n-drift electric field profile;
SOA;
on-state device physics;
39.
Study on quality control in the bonding processing of space solar cell
机译：
太阳能电池粘接加工中的质量控制研究
作者：
Zhao Yanzheng
;
Fu Zhuang
;
Yang Qinghua
;
Cao Qixin
;
Chen Mingbo
;
Zhang Jun
;
Lee J.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
solar cell arrays;
space vehicle power plants;
adhesive bonding;
radiation effects;
protective coatings;
robotic assembly;
non-Newtonian fluids;
quality control;
space solar cell array;
solar cell bonding process;
spacecraft power;
cell anti-irradiation protection;
anti-irradiation cover-glass;
adhesive bonding;
coating thickness;
robotics;
automatic bonding system;
nonvacuum conditions;
nonNewtonian fluid theory;
quality control;
40.
Capacity and reliability of digital watermarking
机译：
数字水印的能力和可靠性
作者：
Zhang Fan
;
Zhang Hongbin
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
watermarking;
error statistics;
reliability;
image coding;
digital watermarking;
image watermarking;
watermarking capacity;
content adaptive watermarking algorithm;
watermarking reliability;
average watermark energy;
bit error rate;
BER;
NVF;
noise visibility function;
blind watermarking;
nonblind watermarking;
41.
Effects of stress and cracks on the reliability of optoelectronic active components
机译：
应力和裂缝对光电活性成分可靠性的影响
作者：
Xu Yong
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
optical fibre subscriber loops;
optical receivers;
optical transmitters;
welding;
stress analysis;
cracks;
telecommunication equipment testing;
thermal stresses;
telecommunication standards;
FTTH;
optoelectronic active components;
reliability;
crack effects;
stress effects;
bi-directional device testing;
stress release;
power change trends;
welding cracks;
output powers;
temperature cycling;
Telcordia standards;
42.
Capacity and reliability of digital watermarking
机译：
数字水印的能力和可靠性
作者：
Zhang Fan
;
Zhang Hongbin
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
watermarking;
error statistics;
reliability;
image coding;
digital watermarking;
image watermarking;
watermarking capacity;
content adaptive watermarking algorithm;
watermarking reliability;
average watermark energy;
bit error rate;
BER;
NVF;
noise visibility function;
blind watermarking;
nonblind watermarking;
43.
Solar cell crack inspection by image processing
机译：
通过图像处理的太阳能电池裂纹检查
作者：
Fu Zhuang
;
Zhao Yanzheng
;
Liu Yang
;
Cao Qixin
;
Chen Mingbo
;
Zhang Jun
;
Lee J.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
solar cells;
crack detection;
automatic optical inspection;
reliability;
image recognition;
image sharpening;
solar cell crack inspection;
inspection image processing;
spaceborne solar cells;
anti-radiation shield bonding process;
edge cracks;
reliability;
gray transform;
image adjustment;
Gauss-Laplacian transform;
contour detection;
crack recognition;
44.
Solar cell crack inspection by image processing
机译：
通过图像处理的太阳能电池裂纹检查
作者：
Fu Zhuang
;
Zhao Yanzheng
;
Liu Yang
;
Cao Qixin
;
Chen Mingbo
;
Zhang Jun
;
Lee J.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
solar cells;
crack detection;
automatic optical inspection;
reliability;
image recognition;
image sharpening;
solar cell crack inspection;
inspection image processing;
spaceborne solar cells;
anti-radiation shield bonding process;
edge cracks;
reliability;
gray transform;
image adjustment;
Gauss-Laplacian transform;
contour detection;
crack recognition;
45.
Analysis of dynamic behavior of solder reflow by solder ball test
机译：
焊球试验焊料回流动力学行为分析
作者：
An Bing
;
Zheng Zonglin
;
Wu Fengshun
;
Lu Jun
;
Zhang Xiaodong
;
Wu Yiping
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
reflow soldering;
printed circuit manufacture;
assembling;
surface mount technology;
solders;
effusion;
vaporisation;
shrinkage;
stability;
bubbles;
SMT printed circuit board assembly;
solder paste/solder ball test;
solder reflow dynamic behavior;
reflow characteristics;
IPC-TM-650 2.4.43 test;
solvent effusion;
solvent volatilization;
solder paste pattern shrinkage;
solder ball shrinkage;
stabilization;
reflow bubbling stage;
defect analysis;
46.
Study on quality control in the bonding processing of space solar cell
机译：
太阳能电池粘接加工中的质量控制研究
作者：
Zhao Yanzheng
;
Fu Zhuang
;
Yang Qinghua
;
Cao Qixin
;
Chen Mingbo
;
Zhang Jun
;
Lee J.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
solar cell arrays;
space vehicle power plants;
adhesive bonding;
radiation effects;
protective coatings;
robotic assembly;
non-Newtonian fluids;
quality control;
space solar cell array;
solar cell bonding process;
spacecraft power;
cell anti-irradiation protection;
anti-irradiation cover-glass;
adhesive bonding;
coating thickness;
robotics;
automatic bonding system;
nonvacuum conditions;
nonNewtonian fluid theory;
quality control;
47.
Effects of stress and cracks on the reliability of optoelectronic active components
机译：
应力和裂缝对光电活性成分可靠性的影响
作者：
Xu Yong
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
optical fibre subscriber loops;
optical receivers;
optical transmitters;
welding;
stress analysis;
cracks;
telecommunication equipment testing;
thermal stresses;
telecommunication standards;
FTTH;
optoelectronic active components;
reliability;
crack effects;
stress effects;
bi-directional device testing;
stress release;
power change trends;
welding cracks;
output powers;
temperature cycling;
Telcordia standards;
48.
Analysis of dynamic behavior of solder reflow by solder ball test
机译：
焊球试验焊料回流动力学行为分析
作者：
An Bing
;
Zheng Zonglin
;
Wu Fengshun
;
Lu Jun
;
Zhang Xiaodong
;
Wu Yiping
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
reflow soldering;
printed circuit manufacture;
assembling;
surface mount technology;
solders;
effusion;
vaporisation;
shrinkage;
stability;
bubbles;
SMT printed circuit board assembly;
solder paste/solder ball test;
solder reflow dynamic behavior;
reflow characteristics;
IPC-TM-650 2.4.43 test;
solvent effusion;
solvent volatilization;
solder paste pattern shrinkage;
solder ball shrinkage;
stabilization;
reflow bubbling stage;
defect analysis;
49.
Self-tuning regulator control scheme in wire bonding process for reliability
机译：
用于可靠性的引线键合过程中自调节稳压器控制方案
作者：
Li Fang
;
Yuehong Yin
;
Xinjun Sheng
;
Han Ding
;
Zhongqin Lin
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
lead bonding;
integrated circuit reliability;
semiconductor device reliability;
force control;
motion control;
controllers;
self-adjusting systems;
optimised production technology;
force control;
linear controller;
motion controller;
self-tuning regulator control scheme;
reliability;
wire bonding process;
bonding force;
bonding time;
bonding temperature;
bonding quality;
bonding failure;
parameter optimization;
bonding pressure;
PMLM;
permanent magnet linear motors;
50.
Design optimization approaches for the thermo-mechanical reliability of land grid array solder joints
机译：
陆网阵列焊点热机械可靠性设计优化方法
作者：
Leon Xu
;
Zben Xue Han
;
Ren Wei
;
Bo Ping Wang
;
Reinikainen T.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
ball grid arrays;
integrated circuit reliability;
soldering;
optimisation;
Young's modulus;
thermal expansion;
finite automata;
finite element analysis;
response surface methodology;
evolutionary computation;
Monte Carlo methods;
solder joint thermomechanical reliability;
land grid array solder joints;
LGA package design optimization;
deterministic optimization method;
land ball array;
temperature cycling;
printed wiring board thickness;
Young's modulus;
coefficient of thermal expansion;
solder joint plastic work per temperature cycle;
finite element simulations;
response surface approximation;
differential evolution algorithm;
quasi-Monte Carlo method;
probability analysis;
51.
Self-tuning regulator control scheme in wire bonding process for reliability
机译：
用于可靠性的引线键合过程中自调节稳压器控制方案
作者：
Li Fang
;
Yuehong Yin
;
Xinjun Sheng
;
Han Ding
;
Zhongqin Lin
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
lead bonding;
integrated circuit reliability;
semiconductor device reliability;
force control;
motion control;
controllers;
self-adjusting systems;
optimised production technology;
force control;
linear controller;
motion controller;
self-tuning regulator control scheme;
reliability;
wire bonding process;
bonding force;
bonding time;
bonding temperature;
bonding quality;
bonding failure;
parameter optimization;
bonding pressure;
PMLM;
permanent magnet linear motors;
52.
Design optimization approaches for the thermo-mechanical reliability of land grid array solder joints
机译：
陆网阵列焊点热机械可靠性设计优化方法
作者：
Leon Xu
;
Zben Xue Han
;
Ren Wei
;
Bo Ping Wang
;
Reinikainen T.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
ball grid arrays;
integrated circuit reliability;
soldering;
optimisation;
Young's modulus;
thermal expansion;
finite automata;
finite element analysis;
response surface methodology;
evolutionary computation;
Monte Carlo methods;
solder joint thermomechanical reliability;
land grid array solder joints;
LGA package design optimization;
deterministic optimization method;
land ball array;
temperature cycling;
printed wiring board thickness;
Young's modulus;
coefficient of thermal expansion;
solder joint plastic work per temperature cycle;
finite element simulations;
response surface approximation;
differential evolution algorithm;
quasi-Monte Carlo method;
probability analysis;
53.
The principle of surface insulation resistance (SIR) testing and its role in establishing the electrochemical reliability of a printed circuit board
机译：
表面绝缘电阻原理（SIR）测试及其在建立印刷电路板电化学可靠性的作用
作者：
Kinner P.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
printed circuit manufacture;
printed circuit testing;
leakage currents;
insulation testing;
electric resistance measurement;
circuit reliability;
process control;
leakage currents;
surface insulation resistance testing;
PCB SIR testing;
PCB electrochemical reliability;
environmentally acceptable production process;
process control;
54.
Photonics in China
机译：
中国的光子学
作者：
Lau D.K.
;
Islam S.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
optical communication equipment;
optical fibre communication;
integrated optoelectronics;
consumer electronics;
international collaboration;
research initiatives;
government policies;
photonics industry;
China;
consumer photonics;
optical communications;
Hong Kong SAR government;
Hong Kong Optoelectronics Association;
international collaboration;
Taiwan;
industrial development;
photonics technology;
55.
The principle of surface insulation resistance (SIR) testing and its role in establishing the electrochemical reliability of a printed circuit board
机译：
表面绝缘电阻原理（SIR）测试及其在建立印刷电路板电化学可靠性的作用
作者：
Kinner P.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
printed circuit manufacture;
printed circuit testing;
leakage currents;
insulation testing;
electric resistance measurement;
circuit reliability;
process control;
leakage currents;
surface insulation resistance testing;
PCB SIR testing;
PCB electrochemical reliability;
environmentally acceptable production process;
process control;
56.
Fabrication of smart card using UV curable anisotropic conductive adhesive (ACA.) part I: optimization of the curing conditions
机译：
使用紫外线固化各向异性导电粘合剂（ACA）的智能卡制备I部分：固化条件的优化
作者：
Lee K.K.
;
Ng K.T.
;
Tan C.W.
;
Chan Y.C.
;
Cheng L.M.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
conducting polymers;
adhesives;
smart cards;
curing;
ultraviolet radiation effects;
integrated circuit packaging;
chip-on-board packaging;
Fourier transform spectra;
spectrochemical analysis;
scanning electron microscopy;
shear strength;
mechanical testing;
environmental factors;
integrated circuit testing;
smart card fabrication;
UV curable anisotropic conductive adhesive;
curing conditions optimization;
green electronics products;
solder substitution;
UV curable ACA;
temperature sensitive electronic packages;
bonding conditions;
plated copper coil micro strip antenna;
fabrication process;
high power UV curing;
chip-on-flex bonding;
post curing;
contactless smart cards;
FTIR chemical analysis;
Fourier transform infrared spectroscopy;
curing degree;
smart card read range;
card reader;
shear test;
ACA joint breaking shear force;
ACA joint failure mode;
curing conditions;
SEM;
scanning electron microscope;
shear strength;
reading distance;
COF bonding;
57.
Electrodeposited tin properties their effect on component finish reliability
机译：
电沉积锡属性及其对组件完成可靠性的影响
作者：
Schetty R.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
tin;
electroplated coatings;
circuit reliability;
semiconductor device reliability;
electron device manufacture;
whiskers (crystal);
grain size;
internal stresses;
crystal orientation;
soldering;
oxidation;
tin whisker growth;
grain size;
grain shape;
internal stress levels;
crystal orientation;
solderability;
oxide resistance;
electrodeposited tin properties;
component finish reliability;
lead-free component finish;
electroplated deposit;
grain structure;
oxide formation;
Sn;
58.
Electrodeposited tin properties their effect on component finish reliability
机译：
电沉积锡属性及其对组件完成可靠性的影响
作者：
Schetty R.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
tin;
electroplated coatings;
circuit reliability;
semiconductor device reliability;
electron device manufacture;
whiskers (crystal);
grain size;
internal stresses;
crystal orientation;
soldering;
oxidation;
tin whisker growth;
grain size;
grain shape;
internal stress levels;
crystal orientation;
solderability;
oxide resistance;
electrodeposited tin properties;
component finish reliability;
lead-free component finish;
electroplated deposit;
grain structure;
oxide formation;
Sn;
59.
Photonics in China
机译：
中国的光子学
作者：
Lau D.K.
;
Islam S.
会议名称：
《International Conference on the Business of Electronic Product Reliability and Liability》
|
2004年
关键词：
optical communication equipment;
optical fibre communication;
integrated optoelectronics;
consumer electronics;
international collaboration;
research initiatives;
government policies;
photonics industry;
China;
consumer photonics;
optical communications;
Hong Kong SAR government;
Hong Kong Optoelectronics Association;
international collaboration;
Taiwan;
industrial development;
photonics technology;
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