Vapor phase soldering is in discussion of the recent past. Some of the topics of our own work are presented in this paper, like the combination of vapor phase reflow soldering with wave soldering process. This combination makes it possible to solder printed circuit boards with SMT and THT components in one step. Additional the inert vapor atmosphere takes on the protection of liquid solder from oxidation. Anothe" current development is an inline condensation soldering system. In a laboratory construction a lot of experiences were collected. The studies shows the importance of understanding the connection of partial pressure and tempera ture as well the mechanism of flow and heat transfer. First results were tested by soldering of true electronic assembles and with lead free solders.
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