首页> 外国专利> Vapor phase soldering plant comprises a conveyor system, which transports soldering good in the vapor phase soldering plant, an inlet sluice, two vapor phase chambers, and outlet sluice

Vapor phase soldering plant comprises a conveyor system, which transports soldering good in the vapor phase soldering plant, an inlet sluice, two vapor phase chambers, and outlet sluice

机译:气相钎焊设备包括一个输送系统,用于在气相钎焊设备中输送良好的钎料,一个入口闸门,两个气相室和一个出口闸门。

摘要

The vapor phase soldering plant comprises a conveyor system, which transports soldering good (20) in the vapor phase soldering plant, an inlet sluice (02), two vapor phase chambers (03.1, 03.2, 03.3), and outlet sluice (04), where a vapor phase (18) exists in the vapor phase chambers in the bottom area. The soldering good is lowered and lifted above the vapor phase or in the vapor phase for soldering according to a reflow process by a vertical conveyor. The soldering good is transported from the inlet sluice through the vapor phase chambers to the outlet sluice by horizontal conveyor. The vapor phase soldering plant comprises a conveyor system, which transports soldering good (20) in the vapor phase soldering plant, an inlet sluice (02), two vapor phase chambers (03.1, 03.2, 03.3), and outlet sluice (04), where a vapor phase (18) exists in the vapor phase chambers in the bottom area. The soldering good is lowered and lifted above the vapor phase or in the vapor phase for soldering according to a reflow process by a vertical conveyor. The soldering good is transported from the inlet sluice through the vapor phase chambers to the outlet sluice by means of horizontal conveyor. The horizontal conveyor is arranged above the vapor phase, and the vapor phase present in the vapor phase soldering plant transverses in the series of the soldering good. An independently driven horizontal conveyor is present in the vapor phase chamber. The horizontal conveyor has a revolving conveyor belt to transport in the vapor phase chamber, and has a first horizontal conveyor belt and a second horizontal conveyor belt in the vapor phase chamber. The first- and/or the second horizontal conveyor belt is horizontally moved transverse to transport direction and releases a vertical passage in the size of the soldering good, where the conveyor belt is formed in the type of a chain conveyor. A distance from the first horizontal conveyor belt to second horizontal conveyor belt is variably adjusted for different size of the soldering goods to be transported. The all horizontal conveyors have a temperature resistance of 200[deg] C. The inlet sluice, each vapor phase chamber and the outlet sluice form a module with its own chamber frame, where the vapor phase soldering plant is expanded as requirement to further vapor-phase chamber-module. The individual soldering process for the respective soldering goods is controllable and guidable in the vapor-phase chamber. The regulation of the vapor phase soldering plant controls the conveyor system such that the retracting soldering good is lowered in the vapor phase chamber standing ready for the next soldering process. An area closed against the atmosphere is formed before introducing the inlet sluice to end of the outlet sluice. An assembly plant is arranged before the vapor phase soldering plant and/or a testing plant is arranged after the vapor phase soldering plant. The soldering good is guided by the regulation by the assembly plant of the vapor phase soldering plant and/or by the testing plant.
机译:气相钎焊设备包括一个输送系统,用于在气相钎焊设备中输送焊料(20),一个入口闸门(02),两个气相腔室(03.1、03.2、03.3)和出口闸门(04),在底部区域的气相室中存在气相(18)。根据竖向输送机的回流工艺,将焊料降低并提升到气相以上或气相中,以进行焊接。焊料通过水平传送带从入口闸门通过气相腔室输送到出口闸门。气相钎焊设备包括一个输送系统,用于在气相钎焊设备中输送焊料(20),一个入口闸门(02),两个气相腔室(03.1、03.2、03.3)和出口闸门(04),在底部区域的气相室中存在气相(18)。根据竖向输送机的回流工艺,将焊料降低并提升到气相以上或气相中,以进行焊接。焊料通过水平传送带从入口闸门通过气相室传输到出口闸门。水平输送机布置在气相上方,并且在气相钎焊设备中存在的气相在一系列钎料中横穿。在气相室中存在独立驱动的水平输送机。水平输送机具有旋转输送带以在气相室中输送,并且水平输送机在气相室中具有第一水平输送带和第二水平输送带。第一和/或第二水平传送带横向于传送方向水平移动,并释放出焊料大小的垂直通道,其中传送带以链式传送带的形式形成。从第一水平输送带到第二水平输送带的距离针对要输送的焊锡的不同尺寸而可变地调节。所有的水平输送机都具有200℃的耐高温性。入口闸门,每个气相腔室和出口闸门形成具有其自己的腔室框架的模块,其中,根据需要扩展了气相钎焊设备,以进一步蒸发蒸汽。相室模块。在气相室中,用于各个焊料的单独的焊接过程是可控的和可引导的。汽相焊接设备的调节控制传送带系统,以便在准备好进行下一个焊接过程的汽相室中降低可收回的焊接物品。在将入口闸门引入出口闸门的末端之前,形成一个与大气隔绝的区域。在汽相焊接厂之前安排一个组装厂,和/或在汽相焊接厂之后安排一个测试厂。焊锡在汽相焊接厂的装配厂和/或测试厂的监管下得到指导。

著录项

  • 公开/公告号DE102009049270A1

    专利类型

  • 公开/公告日2011-04-28

    原文格式PDF

  • 申请/专利权人 ATF AUTOMATISIERUNGSTECHNIK GMBH;

    申请/专利号DE20091049270

  • 发明设计人 BERBERICH MANFRED;

    申请日2009-10-13

  • 分类号B23K1/015;

  • 国家 DE

  • 入库时间 2022-08-21 17:47:38

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