This paper reports about the results of the investigation of process conditions on the wave soldering process using Sn-9Zn solder. The lead-free solder Sn-Zn system has great advantage of the close melting point to Sn-37Pb solder and its cost. But in this system solder there are some problems with bad wettability and active oxidation, therefore, Sn-Zn solder was almost used in reflow process so far. Recently, it is possible to conduct wave soldering process under stable conditions in order to improve wave soldering equipment. Therefore, if oxygen contents were prevented lower, it is thought that wave soldering using Sn-Zn solder can be used. The technology of wave soldering using Sn-Zn solder was reported. However, the relationship between soldering process condition and solderability was rarely discussed in these reports. Then in this paper, the relationship between soldering process condition and solderability is discussed and the possibility of wave soldering using Sn-Zn solder is investigated.
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