Assembly of Flip Chips Utilizing Wafer Applied Underfill

摘要

Wafer-applied underfills are key to the widespread acceptance of flip c hip technology. This NIST-ATP funded consortium is developing the materials and processes for achieving a wafer -applied underfill system that is both self-fluxing and reworkable. In the present work, the factors impacting successful assembly of pre-underfilled chips are studied. Flip chips with the underfill material pre-applied to the devices ware assembled in the lab using production equipment. The presence of the underfill coating was examined for its ir fluence on vision recognition, placement and reflow.