The mechanical stability of Chip Scale Packages (CSP) used in surface mount technology is primary concern. The major concern is the reliability of CSP interconnects under cyclic thermal stress and strain imposed on the system by temperature fluctuations and in-circuit power on/off. In this study, firstly a viscoplastic strain rate and plastic work were investigated. Crack initiation and propagation, and the 3P Weibull cumulative failure were subsequently studied. Finally the effect of double-sided surface mount on the life of solder cracks was investigated. The results of the characterization and an explanation of the double-sided surface mount affecting solder fatigue life are presented in this paper.
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