Chip-scale packages (CSPs) produced with a WLP process flow are particularly advantageous when combined with flip-chip/BGA connections, since direct-chip attach (DCA) parts can thus be produced entirely by a wafer-fab. A new process technology -atmospheric downstream plasma (ADP) gas thinning - allows for the formation of backside thru-silicon contacts for DCA applications. Thru-Silicon designs and manufacturing process flows are introduced as means to produce 3D stacking solutions. Standard silicon IC manufacturing unit-processes must be combined into robust process-flows to allow for the rapid deployment of 3D stacking throughout the industry.
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