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Study of the effects of GaN buffer layer quality on the dc characteristics of AlGaN/GaN high electron mobility transistors

机译:GaN缓冲层质量对AlGaN / GaN高电子迁移率晶体管DC特性的影响研究

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The influence of different buffer layer quality on AlGaN/GaN high electron mobility transistors (HEMTs) dc characteristics was investigated. Dc measurement by parameter analyzer and gate pulse measurement were performed to compare two different buffer layer quality samples. The same Al concentrations of AlGaN with 2μm and 5μm GaN buffer layers on sapphire substrates from two different vendors were used. The defect densities of 2 μm and 5 μm GaN buffer layer's HEMTs structures measured by transmission electron microscopy (TEM) were 7 × 10~9 cm~(-2) and 5 × 10~8 cm~(-2), respectively. There was small difference in drain saturation current and transfer characteristics in HMETs for these two types of buffer. Non-passivated HEMT with 5 μm GaN buffer layer showed no dispersion in gate-lag pulsed measurement at 100 kHz but HEMT with 2 μm GaN buffer layer showed 71% drain current reduction at 100 kHz gate-lag pulsed measurement.
机译:研究了不同缓冲层质量对AlGaN / GaN高电子迁移率晶体管(HEMT)DC特性的影响。通过参数分析仪和栅极脉冲测量进行DC测量以比较两个不同的缓冲层质量样本。使用来自两个不同供应商的蓝宝石底物上的2μm和5μmGaN缓冲层的AlGaN的相同铝浓度。通过透射电子显微镜(TEM)测量的2μm和5μmGaN缓冲层的血压结构的缺陷密度分别为7×10〜9cm〜(-2)和5×10〜8cm〜(-2)。对于这两种缓冲器的HMET中,漏极饱和电流和转移特性差异很小。具有5μmGaN缓冲层的未钝化的HEMT在100kHz下在栅极滞后测量中显示出在栅极 - 滞后测量中的分散,但具有2μmGaN缓冲层的HEMT在100kHz栅极滞后测量下显示出71%的漏极电流降低。

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